Titanium Sputtering Target 99.995% 4N5 PVD
High-Purity PVD Titanium Sputtering Target
Description
Description
Titanium Sputtering Target — 99.995% (4N5) PVD Grade
Ultra-high purity (4N5, 99.995%) titanium sputtering target for magnetron sputtering PVD deposition of Ti, TiN, TiO₂, and TiAlN thin films. Used extensively in the Malaysian semiconductor packaging and hard-coating industries in Penang and Kulim.
Key Specifications
- Purity: 99.995% Ti (4N5)
- Relative density: ≥99%
- Grain size: <200 µm
- Geometry: Disc (standard 2″, 3″, 4″, 6″ diameter) or rectangular
- Thickness: 3 mm, 6 mm, 9 mm
- Backing plate: Copper or OFHC Cu (bonded on request)
Applications
- Ti and TiN hard coating for cutting tools
- TiO₂ photocatalyst films
- TiAlN wear-resistant coatings
- Semiconductor barrier layers
- Biomedical implant coating research
Specify diameter/dimensions, thickness, and backing plate requirement for a formal quotation. Certificate of analysis provided with every target.
