Gold Wire 99.99% Semiconductor Bonding
Ultra-Pure Gold Bonding Wire
Description
Description
Gold Wire — 99.99% Purity for Semiconductor & LED Packaging
Ultra-pure gold wire (99.99% Au, 4N) for semiconductor die bonding, LED encapsulation, integrated circuit packaging, and high-value research applications. Gold’s excellent conductivity, oxidation resistance, and wire-bonding ductility make it indispensable in the Malaysian semiconductor packaging industry cluster (Penang, Kulim).
Key Specifications
- Purity: 99.99% Au (4N)
- Diameter: 18 µm – 500 µm (standard sizes: 18, 20, 25, 50, 75, 100 µm)
- Tensile strength: Per IPC/JEDEC standards
- Elongation: 4% – 6%
- Form: Spool or cut-to-length
Applications
- Semiconductor wire bonding (IC packaging)
- LED encapsulation bond wires
- High-frequency microwave device connections
- Medical device interconnects
- Research and calibration standards
Priced by gold content at current London Fix rate. Specify diameter and total length for quotation.
