Description
Description
Copper Foil for EMI Shielding & Conductive Applications
High-conductivity copper foil for electromagnetic interference (EMI) shielding, PCB copper cladding, conductive tape, and Faraday cage construction. Available as bare copper foil (roll or sheet) or with adhesive backing for easy application to surfaces.
Key Specifications
- Purity: ≥99.9% Cu (oxygen-free copper available)
- Thickness: 0.01 mm – 0.5 mm
- Width: 5 mm – 600 mm (custom slit-to-width)
- Temper: Soft annealed (flexible) or half-hard
- Adhesive backing: Optional conductive or non-conductive adhesive
Applications
- PCB and electronics EMI shielding tape
- Faraday cage panel lining
- RF signal blocking enclosures
- Battery cell wrapping
- Decorative copper surface cladding
Specify thickness, width, and length. Adhesive-backed and double-conductive options available.
