Copper Foam for Thermal Management & Heat Exchange
Open-cell copper foam optimized for high-performance thermal management. The interconnected pore network provides a dramatically increased surface area (compared to solid copper heat sinks), enabling superior forced-convection cooling for power electronics, LED systems, and laser components.
Key Specifications
- Thermal conductivity: Up to 380 W/m·K effective (bulk Cu reference)
- Specific surface area: 1,000 – 10,000 m²/m³
- Thickness: 5 mm – 20 mm
- Porosity: 80% – 92%
- PPI: 10 – 40 (coarser for lower pressure drop)
Applications
- Forced-convection heat sinks for power electronics
- Phase-change heat spreaders
- CPU/GPU cooling research
- Industrial liquid-cooled systems
Specify thickness, PPI, and dimensions for a formal thermal management quotation.
